It is confirmed that Intel’s next generation of Skylake-E / EP processors will feature a new socket, LGA 3647. When this new generation of processors will hit the market, Intel plans to ditch its LGA 2011-3 sockets as Skylake-E processors will be bigger and different in dimensions as compared to Haswell-E and Broadwell-E processors.
You can check out the LGA 3647 in the image below, these images were taken by TweakTown.
It seems that Intel intends to change things with its next generation of processors. The socket in question by manufactured by Foxconn and the motherboard was manufactured by Gigabyte. The socket clearly mentions to support 3647 pin connection, which is exactly 1636 pins more than LGA 2011-3 socket.
However, since Skylake-E is based on 14nm architecture, it requires new socket. LGA 1151 socket was designed by Intel to support its Skylake desktop processors. LGA 3647 is only compatible with the upcoming Skylake and Kaby Lake processors.
Three years from now LGA 2011-3 will be discontinued by Intel and the company will shift its focus towards LGA 3647 socket. As you can clearly see, the socket features a rectangular shape which completely different from previous sockets as they features square shape.
There is a metallic frame right next to the socket, which we here at ToT presume is to support the coolers. However, the socket does not seem to be complete since there Isn’t any support levers to keep the chip in its place.
Do take a look towards the ram slots on the right side of the socket. There are total of six DDR4 DIMM slots, which means that six more slots will be featured on the left side of LGA 3647. This confirms that Skylake-E processors will upgrade the quad channel memory to hexa channel memory. This will allow high capacities in servers and workstations.
