The USB 3.0 Promoter Group today announced the completion of the USB 3.0 specification, the technical map for device manufacturers to deliver SuperSpeed USB technology to the market.
SuperSpeed USB brings data transfer rates up to ten times faster than Hi-Speed USB (USB 2.0) with optimized power efficiency, SuperSpeed USB is the next step in the continued evolution of USB technology. The new standard will be backward compatible with USB peripherals currently in use.
“SuperSpeed USB is the next advancement in ubiquitous technology,” said Jeff Ravencraft, USB-IF president and chairman. “Today’s consumers are using rich media and large digital files that need to be easily and quickly transferred from PCs to devices and vice versa. SuperSpeed USB meets the needs of everyone from the tech-savvy executive to the average home user.”
The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, NEC Corporation, ST-NXP Wireless and Texas Instruments, developed the USB 3.0 specification. The group now has transitioned the specification’s management to the USB Implementers Forum (USB-IF), the managing body of USB specifications. The USB 3.0 Promoter Group is now accepting adopters of the USB 3.0 specification, which has been finalized at the 1.0 level. To download both the specification and adopter agreement, visit http://www.usb.org/developers/docs/.
It is anticipated that initial SuperSpeed USB will appear in 2010 in products, with adoption continuing throughout 2010. The first SuperSpeed USB devices will likely include data-storage devices such as flash drives, external hard drives, digital music players and digital cameras.
