Western Digital has announced that it has successfully developed its next-generation 3D NAND technology, BiCS4, with 96 layers of vertical storage capability. Sampling to OEMs should start in the half ofthis year. Production of products based on the new tech is expected in calendar year 2018.
BiCS4, which was developed jointly with Western Digital’s technology and manufacturing partner Toshiba Corporation, will be initially deployed in a 256-gigabit chip and will subsequently ship in a range of capacities, including a terabit on a single chip.
“Our successful development of the industry’s first 96-layer 3D NAND technology demonstrates Western Digital’s continued leadership in NAND flash and solid execution to our technology roadmap”
WD also highlighted strong ongoing operations at its joint venture manufacturing facilities in Japan. The output mix of its 64-layer 3D NAND technology, BiCS3, will comprise more than 75 percent of its overall 3D NAND bit supply.
